I have over 8 years of experience in PCB design and preparation for mass production and assembly.
My key skills include:
- Multilayer PCB
- High-Speed Digital and Analog System
- High-Density Interconnect (HDI) : Experience with high-density PCBs with fine pitch components and microvias.
- Flexible and Rigid-Flex PCB
- Experience in PCBs for wireless technologies such as BLE, WiFi, LoRa, Zigbee, GPS/GNSS, Sub-GHz, 4G/5G modules, and NB-IoT.
- Systems with microcontrollers like STM32, ESP32, PIC32, dsPIC33, NXP, EFR32, TI MSP430, nRF9160, nRF9161, nRF5340, and nRF52840.
- Systems with processors such as STM32MP1, i.MX8ULP, i.MX7ULP, and i.MX6UL.
- Interfacing with SDRAM, SPI/QSPI/OCTO-SPI flash.
- Parallel Interfaces like DVP camera interfaces.
- Integrating various displays like OLED, LCD, TFT, and ePaper.
- Knowledge of SPI, UART, I2C, CAN, I2S, and Ethernet.
- Proficient in RS232, RS485, and MODBUS.
- Expertise in battery management and charging circuits, isolated and non-isolated DC-DC buck/boost/buck-boost converters, and the use of PMICs
- ADC and DAC