I will design rigid flex pcbs for wearable medical and aerospace devices
Verilog VHDL Simulation for FPGA, Debug and Verify
About this Gig
DESCRIPTION
Need a PCB that bends, folds, or fits inside ultra-compact enclosures?
I design production-ready rigid-flex PCBs for wearables, medical probes, drones, and aerospace optimized for reliability, impedance control, and dynamic flex life.
What you get:
- Stackup design for rigid + flex regions with controlled impedance
- Bend radius optimization, coverlay/covercoat selection, stiffener placement
- High-density interconnect (HDI): microvias, blind/buried vias
- Material selection: Polyimide, FR-4 hybrid, high-temp flex laminates
- DFM/DFA guidance: component placement on rigid zones only
- Deliverables: Gerbers, IPC-2223 flex notes, BOM, assembly drawings, 3D STEP
Ideal for:
- Wearable health monitors, smart textiles, AR/VR headsets
- Medical catheters, endoscopic probes, implantable prototypes
- Foldable drones, compact industrial sensors, aerospace harnesses
- Prototype to pre-production flex-rigid subsystems
Tools:
- KiCad
- Altium Designer
- EasyEDA
Standards-aware: IPC-2223, IPC-6013, medical/aerospace documentation support
Message me with your mechanical envelope.
Thank you.
Other Electronics Engineering Services I Offer
FAQ
What copper weights do you support?
I design for 3oz up to 20oz+ copper. Share your current requirements and ambient temp — I'll recommend the optimal stackup per IPC-2152.
Do you simulate thermal performance?
Yes — Premium includes a thermal resistance report showing hotspot analysis via simulation. Formal thermal chamber testing requires hardware validation.
Can you design for busbar integration or external heatsinks?
Absolutely. I include reinforced pad footprints, mechanical mounting holes, and thermal interface guidance for busbars or heatsink attachment.

