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I will layout heavy copper pcbs for high current power and battery systems
Verilog VHDL Simulation for FPGA, Debug and Verify
Hi!
I’m Elieo, an FPGA & Embedded Hardware Engineer with 5+ years of experience.
I work on FPGA simulation, RISC-V systems, debugging, and hardware acceleration for AI and DSP applications.
I del...
About this Gig
DESCRIPTION
Need a PCB that handles high current without overheating or voltage drop?
I design heavy copper PCBs (3oz20oz+) for EV battery systems, solar inverters, motor drives, and industrial power distribution optimized for thermal performance, current capacity, and reliability.
What you get:
- Copper weight selection (3oz20oz+) with IPC-2152 current capacity calculations
- Thermal via arrays, copper coin inserts, heatsink integration footprints
- High-current trace width/spacing per IPC-2152, voltage drop analysis
- Busbar-style layouts, reinforced pads, high-temp solder mask options
- EMI reduction: ground planes, shielding zones, snubber circuit placement
- Deliverables: Gerbers, BOM with high-current MPNs, thermal report, assembly drawings
Ideal for:
- EV battery management systems (BMS), charging stations
- Solar/wind inverters, industrial UPS, motor controllers
- High-power LED arrays, welding equipment, power distribution boards
- Prototype to pre-production high-current subsystems
Tools: KiCad / Altium Designer / EasyEDA
Standards-aware: IPC-2152 current ratings, thermal safety margins documented
Message me with your current/thermal specs.
Thank you for considering me.
Other Electronics Engineering Services I Offer
FAQ
What copper weights do you support?
I design for 3oz up to 20oz+ copper. Share your current requirements and ambient temp — I'll recommend the optimal stackup per IPC-2152.
Do you simulate thermal performance?
Yes — Premium includes a thermal resistance report showing hotspot analysis via simulation. Formal thermal chamber testing requires hardware validation.
Can you design for busbar integration or external heatsinks?
Absolutely. I include reinforced pad footprints, mechanical mounting holes, and thermal interface guidance for busbars or heatsink attachment.
