I will optimize your high speed pcb design for dfm and signal integrity
Rigid Flex and HDI PCB Layout Expert
About this Gig
Is your high speed PCB design failing manufacturing rules, suffering from cross talk, or dropping data packets?
High speed layouts require rigorous physics based routing, not just simple wire connections. I am a professional electronics engineer specializing in signal integrity, power integrity (SI/PI), and strict DFM (Design for Manufacturing) optimization.
I will audit, trace, and repair your existing board layout to ensure flawless real world performance.
What I optimize in this gig:
- Signal Integrity: Crosstalk mitigation, proper return paths, reflection elimination, and precise length/phase matching.
- Impedance Control: Stackup calculation and trace restructuring for high-speed interfaces like USB, PCIe, HDMI, Ethernet, Wi-Fi, and BLE.
- Power Integrity: Decoupling capacitor optimization and power plane slicing to minimize voltage drops and noise.
- DFM Compliance: Clearance adjustments to pass rigorous fabrication checks and reduce radiated emissions.
I resolve native engineering files directly inside Altium Designer and KiCad to deliver clean, production ready Gerber files.
Kindly message me with your layout files and datasheets before ordering for a custom diagnostic quote.
FAQ
What files do you need to perform the signal integrity audit?
I require your native PCB design source files (Altium Designer or KiCad), your schematics, the layer stackup details from your intended manufacturer, and the datasheets for any high speed components, microcontrollers, or RF chips used in the design.
Can you fix a layout that failed commercial EMI/EMC testing?
Yes. Failing electromagnetic compliance is usually caused by poor return paths, lack of shielding, or incorrect power plane slicing. I will analyze your PCB layout, isolate the noisy traces, optimize your stitching vias, and reroute paths to significantly lower radiated emissions.
How do you handle controlled impedance matching?
I calculate precise track widths and coplanar waveguide gaps based on your specific dielectric material, layer height, and copper thickness. I manually tune traces for high speed protocols like USB, PCIe, HDMI, Ethernet, and RF antennas to achieve exact 50-ohm or 90/100-ohm differential impedance.
What is the difference between your DFM and SI/PI optimization?
DFM (Design for Manufacturing) ensures the factory can physically build your board without copper slivers, clearance errors, or drill breakouts. SI/PI (Signal & Power Integrity) focuses on the physics of your signals, eliminating cross talk, timing skew, and voltage drops across your power rails.
Will I receive updated manufacturing files after the optimization?
Absolutely. Once the layout fixes are complete, I perform a final Design Rule Check (DRC). I then deliver the fully optimized native source files along with production ready Gerber files (X2), an updated Bill of Materials (BOM), and assembly drawings for immediate fabrication.

