I will do power electronics thermal and cooling simulation using cfd and fea

Note: Please contact me before placing an order to ensure your project is within my scope and to receive an accurate delivery time and cost estimate.

Welcome!

Are you facing overheating or thermal reliability issues in your power electronics systems? I specialize in thermal and cooling simulations for power electronics using CFD (Computational Fluid Dynamics) and FEA (Finite Element Analysis) to help you design efficient, safe, and compact systems.

With over 14+ years of experience in simulation, I provide accurate thermal modeling, performance analysis, and optimization services for your devices, enclosures, and PCBs.

What I Offer:

• Thermal analysis of MOSFETs, IGBTs, heat sinks, and power modules
• Forced & natural convection cooling simulation
• Heat sink selection and optimization
• PCB-level thermal simulation (via Icepak, Flowtherm, Fluent, etc.)
• Liquid/air cooling simulation
• Junction-to-case, junction-to-ambient temperature profiling
• Thermal resistance & hotspot analysis
• Coupled electrical-thermal studies (if needed)

Why Choose Me?

• Deep expertise in power electronics cooling
• Professional-grade simulation tools
• Fast delivery with detailed reports
• NDA and confidential