I will design multi layer high speed pcb layout with impedance control

Hello, I'm Mason! Drawing on 7+ years of specialized hardware engineering, I design multi-layer PCB layouts for high-speed digital electronics and complex microprocessors.

I handle tough routing challenges, including BGA breakout, length matching, and trace impedance control. My layouts minimize noise and electromagnetic interference (EMI) so your hardware operates reliably.

What I Will Do:

• Define multi-layer layer stackups (4, 6, or 8 layers) with ground planes
• Route controlled impedance traces for USB, Ethernet, HDMI, and SPI
• Perform trace length matching and differential pair routing
• Manage fan-out routing for dense BGA and QFN chips
• Apply decoupling capacitor placement close to power pins
• Deliver full fabrication files (Gerbers, NC Drill, Assembly Drawings)
• Export 3D STEP files for seamless mechanical housing fit checks

What I Need From You:

• Complete schematic file (KiCad, Altium, or EasyEDA)
• Datasheets for high-speed chips or BGA components
• Target PCB stackup specifications or fab house requirements
• Board outline constraints and mechanical mounting requirements

Drop me a direct message now so we can map out your multi-layer board specs!!