I will do pcb enclosure plastic injection mold and electronic housing for 3d printing
About this gig
Are you looking for a professional PCB enclosure or electronic product housing for your device? I will help you de sign a high quality custom enclosure ready for 3D printing, CNC machining, or plastic injection molding.
I specialize in creating functional and manufacturing ready designs for startups, engineers, and product developers.
What I Can Design:
- PCB Enclosure De sign
- Electronic Device Housing
- Arduino & Raspberry Pi Enclosures
- IoT Device Cases
- Plastic Enclosures for Injection Molding
- CNC Machined Enclosures
- 3D Printable Cases
- Product Casing & Mechanical De sign
What You Will Receive:
- Professional 3D CAD Model
- STL / STEP / OBJ Files
- Design ready for 3D printing or manufacturing
- High quality and accurate de sign
- Fast communication and support
I focus on clean, functional and production ready de signs that manufacturers can easily use.
Send me a message before ordering so we can discuss your project.
Delivery style preference
Please inform the freelancer of any preferences or concerns regarding the use of AI tools in the completion and/or delivery of your order.
Get to know Hauwa
PLASTIC, SILICONE MOLD AND ENCLOSURE DESIGN SPECIALIST
- FromNigeria
- Member sinceJul 2024
- Avg. response time7 hours
Languages
English, German, French, Italian
Other Industrial & Product Design Services I Offer
FAQ
1. What information do you need to start?
I need your PCB dimensions, component height, mounting holes, and product requirements.
2. Can you de sign enclosures for Arduino or Raspberry Pi?
Yes. I can design Arduino, Raspberry Pi, IoT device, and custom electronics enclosures.
3. Will the enclosure be ready for manufacturing?
Yes. I can design enclosures ready for 3D printing, CNC machining, or injection molding
4. What file formats will I receive?
You will receive STL, STEP, OBJ, and other CAD files needed for manufacturing
5. Can you modify an existing enclosure de sign?
Yes. I can edit, improve, or redesign existing 3D enclosure models.

