I will do high density pcb boards and multiple layers

Expert High-Speed HDI PCB Design | Rockchip, NXP, TI & ARM SoCs

I offer professional HDI PCB Design services for complex Single Board Computers (SBCs) and industrial modules. With 6+ years of experience, I specialize in navigating the strict constraints of High-Density Interconnect (HDI) layouts and high-speed signal integrity.

SoC Expertise

I have extensive experience designing carrier boards and systems for:

• Rockchip: RK3588, RK3588S, RK3566, RK3399, RK3288.
• NXP i.MX Series: i.MX 8M, 8M Mini, 8M Nano, 8M Plus.
• TI Sitara: AM6442, AM62x.
• Allwinner & Amlogic: H616, S905 series.
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High-Speed Interface Specialization

• Memory: LPDDR4, LPDDR4X, DDR4, and DDR3L (Fly-by & T-Topology).
• Storage: eMMC 5.1, SDIO 3.0, and NVMe (PCIe Gen 3/4).
• Display & Camera: MIPI DSI/CSI (FPC), HDMI 2.1 (8K), DisplayPort.
• Connectivity: Gigabit Ethernet (RGMII), USB 3.1, PCIe, and RF/WiFi/BT sections.

Design Capabilities

• HDI Technology: 4 to 12+ Layers with Blind/Buried Vias and Microvia stacks.
• Precision Layout: 0.4mm to 0.8mm BGA pitch escape routing.
• Signal Integrity (SI): Length matching, differential pair tuning
• Power Integrity (PI): PDN analysis for high-current CPU/GPU cores.